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公告日期 | 2022-07-06 |
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公告 | [轉發] 美商迅馳半導體徵才資訊 |
內容 | Building the future of WiGig/60GHz We are a leading provider of wireless technologies for 5G infrastructure product and looking for individuals who have high energy, are critical thinkers, and like to move fast. If you are passionate about what you do and would like to apply for any of our open positions, please contact us. Thank you in advance for your consideration and we look forward to talking with you soon. Our Current Job Openings ASIC Design Engineer We are a pioneer in cutting edge technology for high speed millimeter wave wireless communication and offers ultra-low power products supporting 802.11ad WiGig standard. In this highly visible role, the candidate will have an opportunity to work on complex ASIC designs for our 60GHz 802.11ad SoC, including mixed-signal Beamforming RFIC. The candidate will work on many phases of ASIC development process ranging from architecture, design to tape-out, and chip bring-up. Modem Design Engineer We are currently seeking candidates for positions involving the design and implementation of 5G modem architecture, interfaces and control logics for connectivity RF/Analog system. Successful candidates will be responsible for participating in, the design of leading-edge ASICs for 5G SoC platform. Candidates will implement and deliver RTL and will work with verification engineers or develop unit-level and integrated-level test benches. Candidate will assist in synthesis and gate-level simulation tasks related to your module and will assist in verification and timing of the entire chip. IC Layout Engineer Candidate must be proficient with our design tools IC5 & 6.x Candence Virtuoso environment. Understanding of semiconductor process and device physics. Knowledge of layout techniques for device matching, minimizing parasitic, RF shielding, and high frequency routing. Understanding of RC delay, EM, and Cross-talk. H/W Design Engineer As a team member of Tensorcom's hardware development team, you will mainly be responsible for wireless communication system hardware development. Circuit design, PCB layout review (EMI / EMC / noise prevention) Software Develop Engineer Windows/ Linux/ iOS device driver development. Skilled in C/C++ programming language. Familiarity with H/W system architecture. Network OSI model architecture. Wireless communication. RF Test Engineer Intern Manage and responsible for IC/module production test at offshore contracted manufacturer including following items: Wafer level chip test system, Chip level test system, Module level test system, Other ATE system. Contact Email: Line: @823xrabn Office: 新竹縣竹北市高鐵七路65號 Website: https://tensorcom.com Tensorcom is an equal opportunity employer with a commitment to diversity. |
公告人員 | 62301 楊小姐 |
附件 | Careers_at_Tensorcom-t.pdf |