S. De, Md. A. Baig, B.-H. Qiu, H.-H. Le, Y.-J. Lee* and D. Lu*, “Neuromorphic Computing with Fe-FinFETs in the Presence of Variation,” to be presented at VLSI Technology, Systems and Applications (VLST-TSA), Hsinchu, Taiwan, 2022.
Szu-Han Hu, Min-Jung Tsai, Fang-Rong Zhang, Ke-Jing Lee, Dar-Sen Lu, Ting-Chang Chang, Yeong-Her Wang*, “Stacked Three-dimensional Crossbar Resistive Random Access Memory based Synapse for Neuromorphic Computing, “International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 2021.
Min-Jung Tsai, Szu-Han Hu, Chih-Wei Hunag, Ke-Jing Lee, Darsen Lu, Ting-Chang Chang, Yeong-Her Wang*, “HfO2 and TiO2 Stacking Resistive Random Access Memory Structure for Neuromorphic Synapse Applications,“ International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 2021.
Parthasarathi Pal, Chih-Wei Huang, Darsen Lu, Yeong-Her Wang*, “High Temperature Stability of A Flexible Stacked Resistive Memory Device in the Deep Neural Network Application,” International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 2021.
Parthasarathi Pal, Fang-Rong Zhang, Darsen D. Lu, and Yeong-Her Wang*, “Effect of an Interfacial layer on the Thermal and Mechanical Stability of a Heterogeneous Flexible Resistive Switching Device in the Deep Neural Network Simulations,” The 9th International Conference on Science, Education, and Viable Engineering (ICSEVEN), Taitung, Taiwan, Oct. 2021.
D. D. Lu* and I.-H. Chen, “A Novel Three-Dimensional 6T-SRAM Cell Featuring Vertical Transistors and 24F2 Layout Area,” IEEE Intl. Conf. on App. Science & Innovation (ICASI), Alishan, Chiayi, Taiwan, Sep. 2021, DOI: 10.1109/ICASI52993.2021.9568447.
S.-W.Chang, T.-H. Lu, C.-Y. Yang, C.-J. Yeh, M.-K. Huang, C.-F. Meng, P.-J. Chen, T.-H. Chang, Y.-S. Chang, J.-W. Jhu, T.-Z. Hong, C.-C. Ke, X.-R. Yu, W.-H. Lu, M. A. Baig, T.-C. Cho, P.-J. Sung, C.-J. Su, F.-K. Hsueh, B.-Y. Chen, H.-H. Hu*, C.-T. Wu, K.-L. Lin, W. C.-Y. Ma, D.-D. Lu, K.-H. Kao, Y.-J. Lee*, C.-L. Lin, K.-P. Huang, K.-M. Chen, Y. Li, S. Samukawa, T.-S. Chao, G.-W. Huang, W.-F. Wu, W.-H. Lee, J.-Y. Li, J.-M. Shieh, J.-H. Tarng, Y.-H. Wang*, W.-K. Yeh, “First Demonstration of Heterogeneous IGZO/Si CFET Monolithic 3D Integration with Dual Workfunction Gate for Ultra Low-power SRAM and RF Applications,” Proc. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, Dec. 13-15, 2021.
S. De*, D. D. Lu*, H.-H. Le, S. Mazumder, Y.-J. Lee*, W.-C. Tseng, B.-H. Qiu, Md. A. Baig, P.-J. Sung, C.-J. Su, C.-T. Wu, W.-F. Wu, W.-K. Yeh, Y.-H. Wang, “Ultra-Low Power Robust 3bit/cell Hf0.5Zr0.5O2 Ferroelectric FinFET with High Endurance for Advanced Computing-In-Memory Technology,“ Proc. Symposium on VLSI Technology, Kyoto, Japan, Jun. 13-19, 2021.
J.-Y. Ciou, S. De*, C.-W. Wang, W. Lin, Y.-J. Lee and D. Lu*, “Analytical Modelling of Ferroelectricity Instigated Enhanced Electrostatic Control,” 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Chengdu, China, Apr. 2021, DOI: 10.1109/EDTM50988.2021.9420931.
S. De*, W.-X. Bu, B.-H. Qiu, C.-J. Su, Y.-J. Lee and D. D. Lu*, “Alleviation of Charge Trapping and Flicker Noise in HfZrO2-Based Ferroelectric Capacitors by Thermal Engineering,” IEEE International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 2021, DOI: 10.1109/VLSI-TSA51926.2021.9440091.
Pei-En Lin, Chia-Hao Cheng, Ching-Hsiang Chang, Cheng-Hsien Tsai, Darsen D. Lu, Yi-Ting Tseng, Ting-Chang Chang, Jen-Sue Chen, “Electroforming-free resistive switching of WOx/ZrOx stack for neuromorphic computing systems,” Materials Challenges for Memory (MCFM), Apr. 11-13, 2021.
S. De*, D. D. Lu*, H.-H. Le, S. Mazumder, Y.-J. Lee*, W.-C. Tseng, B.-H. Qiu, Md. A. Baig, P.-J. Sung, C.-J. Su, C.-T. Wu, W.-F. Wu, W.-K. Yeh, Y.-H. Wang, “Ultra-Low Power Robust 3bit/cell Hf0.5Zr0.5O2 Ferroelectric FinFET with High Endurance for Advanced Computing-In-Memory Technology,“ Proc. Symposium on VLSI Technology, Kyoto, Japan, Jun. 13-19, 2021, https://ieeexplore.ieee.org/document/9508674 .
S. De, Md. A. Baig, B.-H. Qiu, D. Lu*, P.-J. Sung, F.-K. Hsueh, Y.-J. Lee, C.-J. Su, “Tri-Gate Ferroelectric FET Characterization and Modelling for Online Training of Neural Networks at Room Temperature and 233K,” IEEE Device Research Conference (DRC), Ohio State University, Ohio, USA, Jun. 2020, DOI: 10.1109/DRC50226.2020.9135186.
H.-H. Le, W.-C. Hong, J.-W. Du, T.-H. Lin, Y.-X. Hong, I-H. Chen, W.-J. Lee, N.-Y. Chen and D. D. Lu*, “Ultralow Power Neuromorphic Accelerator for Deep Learning Using Ni/HfO2/TiN Resistive Random Access Memory,” 4th IEEE Electron Devices Technology and Manufacturing Conference (EDTM), Penang, Malaysia, Mar. 2020, DOI: 10.1109/EDTM47692.2020.9117915.
T.-Z. Hong, W.-H. Chang*, A. Agarwal, Y.-T. Huang, C.-Y. Yang, T.-Y. Chu, H.-Y. Chao, Y. Chuang, S.-T. Chung, J.-H. Lin, S.-M. Luo, C.-J. Tsai, M.-J. Li, X.-R. Yu, N.-C. Lin, T.-C. Cho, P.-J. Sung*, C.-J. Su, G.-L. Luo, F.-K. Hsueh, K.-L. Lin, H. Ishii, T. Irisawa, T. Maeda, C.-T. Wu, W. C.-Y. Ma, D.-D. Lu, K.-H. Kao, Y.-J. Lee*, H. J.-H. Chen, C.-L. Lin, R. W. Chuang, K.-P. Huang, S. Samukawa, Y.-M. Li, J.-H. Tarng, T.-S. Chao, M. Miura, G.-W. Huang, W.-F. Wu, J.-Y. Li, J.-M. Shieh, Y.-H. Wang, W.-K. Yeh, “First Demonstration of heterogenous Complementary FETs utilizing Low-Temperature (200 °C) Hetero-Layers Bonding Technique (LT-HBT),” Proc. IEEE International Electron Devices Meeting (IEDM), Dec. 2020, DOI: 10.1109/IEDM13553.2020.9372001.
P. J Sung, C. J. Su, D. D. Lu et al., “Fabrication of Ω-gated Negative Capacitance FinFETs and SRAM,” VLSI Technology, Systems and Applications (VLSI-TSA), 2019, DOI: 10.1109/VLSI-TSA.2019.8804663.
S.-W. Chang, P.-J. Sung, T.-Y. Chu, D. D. Lu et al., “First Demonstration of CMOS Inverter and 6T-SRAM Based on GAA CFETs Structure for 3D-IC Applications,” Proc. IEEE International Electron Devices Meeting (IEDM), 2019, DOI: 10.1109/IEDM19573.2019.8993525.
D. D. Lu et al., “(Invited) Compact Device Models for FinFET and Beyond,” Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD) Tech. Dig., Kitakyushu, Japan, July 2018, arXiv:2005.02580.
D. D. Lu, F.-X Liang, Y.-C. Wang and H.-K. Zeng, “NVMLearn: A Simulation Platform for Non-Volatile-Memory-Based Deep Learning Hardware,” IEEE Intl. Conf. on App. Science & Innovation (ICASI), Sapporo, Japan, May 2017, DOI: 10.1109/ICASI.2017.7988347. (First Prize Paper Award)
D. D. Lu, A. B. Sachid, Y.-M. Huang, Y.-J. Chen, C.-C. Chen, M.-C. Chen, C. Hu, “Stressor Design for FinFETs with Air-Gap Spacers,” VLSI Technology, Systems and Applications (VLSI-TSA), Apr. 2017, DOI: 10.1109/VLSI-TSA.2017.7942485.
T. Yamashita, S. Mehta, V.S. Basker, R. Southwick, A. Kumara, R. Kambhampatib, R. Sathiyanarayanana, J. Johnsona, T. Hook, S. Cohen, J. Li, A. Madan, Z. Zhu, L. Tai, Y. Yao, P. Chinthamanipeta, M. Hopstaken, Z. Liu, D. Lu et al., “A Novel ALD SiBCN Low-k Spacer for Parasitic Capacitance Reduction in FinFETs,” Symposium on VLSI Technology, Digest of Technical Papers, June 2015, DOI: 10.1109/VLSIT.2015.7223659.
P. Morin, L. Grenouillet, N. Loubet, A. Pofelski, D. Lu et al., “Mechanical analyses of extended and localized UTBB stressors formed with Ge enrichment techniques,” ECS Transactions, vol. 66, no. 4, pp. 57-65, 2015, DOI: 10.1149/MA2015-01/21/1364.
D. Lu, K. Cheng, P. Morin, N. Loubet, T. Hook, and D. Guo et al., “Dielectric Isolated FinFET on Bulk Substrate,” IEEE S3S conference, Oct. 2014, DOI: 10.1109/S3S.2014.7028188.
K. Cheng, S. Seo, J. Faltermeier, D. Lu et. al., “Bottom Oxidation through STI (BOTS) – A Novel Approach to Fabricate Dielectric Isolated FinFET on Bulk Substrates,” Symposium on VLSI Technology, Digest of Technical Papers, June 2014, DOI: 10.1109/VLSIT.2014.6894390.
D. Lu, P. Morin, B. Sahu, T. B. Hook, P. Hashemi and A. Scholze et al., “(Invited) Silicon Germanium FinFET Device Physics, Process Integration and Modeling Considerations,” ECS Transactions, vol. 64, no. 6, pp. 337-345, 2014, DOI: 10.1149/06406.0337ecst.
D. D. Lu, J. Chang, M. A. Guillorn, C.-H. Lin, J. Johnson, P. Oldiges and K Rim, “A comparative study of fin-last and fin-first SOI FinFETs,” International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Sept. 2013,DOI: 10.1109/SISPAD.2013.6650596.
A. Khakifirooz, R. Sreenivasan, B.N. Taber, F. Allibert, P. Hashemi, W. Chern, N. Xu, E.C. Wall, S. Mochizuki, J. Li, Y. Yin, N. Loubet, A. Reznicek, S.M. Mignot, D. Lu et. al., “Aggressively Scaled Strained Silicon Directly on Insulator (SSDOI) FinFETs,” Proceedings of the S3S Conference, pp. 147-150, 2013, DOI: 10.1109/S3S.2013.6716520.
S.-J. Han, S. Oida, K. A. Jenkins, D. D. Lu, "High fMAX/fT ratio in multi-finger embedded T-shaped gate graphene transistors, " IEEE Device Research Conference, 2013, DOI: 10.1109/DRC.2013.6633781.
D. Lu, C.-H. Lin, A. Niknejad and C. Hu, “Multi-Gate MOSFET Compact Model BSIM-MG,” a chapter in Compact Modeling Principles, Techniques, and Applications (ISBN: 978-90-481-8613-6), Springer, 2010, DOI: 10.1007/978-90-481-8614-3_13.
D. D. Lu, C.-H. Lin, S. Yao, W. Xiong, F. Bauer, C. R. Cleavelin, A. M. Niknejad, and C. Hu, “Design of FinFET SRAM Cells using a Statistical Compact Model,” International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Sept. 2009, DOI: 10.1109/SISPAD.2009.5290234.
T. H. Morshed, M. V. Dunga, J. Zhang, D. D. Lu, A. M. Niknejad and C. Hu, "Compact Modeling of Flicker Noise Variability in Small Size MOSFETs," International Electron Device Meeting (IEDM), Dec. 2009, DOI: 10.1109/IEDM.2009.5424237.
C.-H. Lin, M. V. Dunga, D. Lu, A. M. Niknejad and C. Hu, ”Statistical Compact Modeling of Variations in Nano MOSFETs,” Proc. VLSI Technology, Systems and Applications (VLSI-TSA), Oct 2008, DOI: 10.1109/VTSA.2008.4530849.
M. V. Dunga, C.-H. Lin, D. D. Lu, W. Xiong, C. R. Cleavelin, P. Patruno, J.-R. Huang, F.-L. Yang, A. M. Niknejad, and C. Hu, “BSIM-MG: A versatile multi-gate FET model for mixed-signal design,” Symposium on VLSI Technology, June 2007, DOI: 10.1109/VLSIT.2007.4339727. (Best Student Paper Award)
D. D. Lu, M. V. Dunga, C.-H. Lin, A. M. Niknejad and C. Hu, ”A Multi-Gate MOSFET Compact Model Featuring Independent-Gate Operation,” International Electron Device Meeting (IEDM), Dec. 2007, DOI: 10.1109/IEDM.2007.4419001.
Darsen D. Lu, "Applications of Memory-Device Compact Models toward Neuromorphic Circuits for Artificial Intelligence," Nano Korea, KINTEX, South Korea, 7/3-5, 2019
Darsen Lu, "Enabling Electronic Circuit Simulation for New Semiconductor Technologies -- using the Double-Gate MOS Transistor as an Example, " 2018 Conference on Advanced Topics and Auto Tuning (ATAT) in High-Performance Scientific Computing, Tainan, Taiwan, 2018
D. Lu, C.-H. Lin, M. Dunga, A. Niknejad and C. Hu, ”A compact model for Asymmetric Multi-gate MOSFETs with Effieicnt Surface Potential Approximations”, 2007 SRC TECHCON (Best in Session)
C. Hu, M. Dunga, C. H. Lin, D. Lu, A. M. Niknejad, ”Comapct Modeling for New Transistor Structures,” SISPAD 2007, pp. 285-288, Sep 2007.
D. Lu and C. Hu, “A Compact Model for Parasitic Resistance in FinFETs,” 2009 SRC TECHCON.
Chenming Hu, Ali Niknejad, V. Sriramkumar, Darsen Lu, Yogesh Chauhan, Muhammed Kahm, Angada Sachid, "BSIM-IMG: A Turnkey compact model for fully depleted technologies," SOI Conference 2012
D. Lu et al., “A Multi-Gate CMOS Compact Model – BSIMMG,” 2010 MOS-AK Workshop.
Darsen D. Lu, Huai-Kuan Zeng, Yi-Ci Wang, Fu-Xiang Liang (2017, Sep). Nvmsim: a Computer-aided-design Tool for Nonvolatile Memory Based Cognitive Computing Hardware. International Confererence on Cognitive Science